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Innovative eco friendly traps for the control of
Pine Lepidoptera in urban and recreational places

TECHNOLOGICAL WATCH

Type of information: PATENTS

In this section, you can access to the latest technical information related to the PISA project topic.

Wafer-Level Underfill and Over-Molding

A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.


» Number: US2018175013A1 (A1)

» Publication Date: 18//2/21/0

» Applicant: TAIWAN SEMICONDUCTOR MFG COMPANY LTD?[TW]

» Inventor: JANG BOR-PING?[TW]; LIU CHUNG-SHI?[TW] (2)

» More Information

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