Img preview

Innovative eco friendly traps for the control of
Pine Lepidoptera in urban and recreational places

TECHNOLOGICAL WATCH

Type of information: PATENTS

In this section, you can access to the latest technical information related to the PISA project topic.

Multi-layer injection molded device housings

A housing for an electronic device includes a single rear housing assembly coupled to the cover glass of a display assembly. The rear housing assembly includes a metal rear chassis with two layers of injection molded material formed on at least the chassis side regions. The first injection molded layer includes a high reinforcing agent content percentage to provide increased stiffness, and the second injection molded layer includes a low reinforcing agent content percentage, which provides less structural support than the first injection molded layer, but an improved aesthetic appearance.


» Number: US10019029B1 (B1)

» Publication Date: 18//2/10/0

» Applicant: AMAZON TECH INC?[US]

» Inventor: YU MICHAEL XINGYI?[US]; POTENS BRANDON MICHAEL?[US] (10)

» More Information

« Go to Technological Watch








The development of this web server has been co-funded with the support of the LIFE financial instrument of the European Union [LIFE13 ENV/ES/000504]

AIMPLAS Instituto Tecnológico del Plástico
C/ Gustave Eiffel, 4 (Valčncia Parc Tecnolňgic) 46980 - PATERNA (Valencia) - SPAIN
(+34) 96 136 60 40
proyectos@aimplas.es